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Productronica– Day 2

Productronica– Day 2

Day 2 is in the books: more traffic and lots of excitement for BPM’s latest innovation, the BPM310 Automated Programmer. Automotive, Contract Manufacturers and Consumer Electronics companies are among those interested.

The BPM310 is positioned to outperform higher-priced systems and includes advanced features such as WhisperTeach™, on-the-fly vision alignmentCSP supportserializationencryption, and JobMaster while providing true universal technology. 10th Generation site technology supports the broadest range of devices including MCUs, eMMC, NAND, Serial Flash, UFS, and others. Highly configurable, the BPM310 provides options for Tape I/O, Tray I/O, Tube I/O, laser marking, and 3D inspection.

Productronica in Munich Germany is the second-largest electronics trade show in the world and continues through November 19, 2021.

Learn about BPM310 | US Tech Article | BPM310 Press Release

Productronica Day One

Productronica Day One

After a lengthy break from tradeshows, BPM is pleased to showcase its latest innovation: the BPM310 Automated Programming System. The first 10th Generation programmer offers the industry’s fastest programming times for UFSeMMCFlash, and MCUs with twice as many sockets per site as its predecessor. The BPM310 offers a capacity of up to 48 sockets, automotive-level quality, and reliability in a small footprint. 10th Gen delivers the fastest UFS programming performance in the industry achieving up to 440MB per second Read and 201MB per second Write. First-part time is accelerated because UFS programming can commence without pausing for data to download.
“The BPM310 with 32 sockets and TS1500 (tray stacker) is running flawlessly– 6,000 devices and counting,” says Colin Harper, Global Sales Director and Product Manager at BPM Microsystems. “It’s great to connect with customers and industry colleagues. It’s been too long!”
BPM is partnering with its European Distributor, Adaptsys, to launch this new product into the market.
If you are attending Productronica, please come by and see the BPM310 in Hall A1, Stand 353.
BPM will also showcase the BPM310 at APEX in San Diego in January 2022 for the American audience.
Productronica, Day 1 Colin Harper and James Cawkell

Colin Harper, BPM’s Global Sales Director, and James Cawkell, BPM’s Distributor in Europe, show off the latest APS from BPM, the BPM310.

BPM Microsystems Launches the BPM310– 10th Generation Universal Automated Programming System with 48 sockets and UFS Support

BPM Microsystems Launches the BPM310– 10th Generation Universal Automated Programming System with 48 sockets and UFS Support

BPM Microsystems, Inc. announces the release of its 10th Generation programming technology platform and the BPM310 Automated Programming System. The 10th Generation offers the industry’s fastest programming times for UFS, eMMC, Flash, and MCUs with twice as many sockets per site as its predecessor. The BPM310 offers a capacity of up to 48 sockets, automotive-level quality, and reliability in a small footprint. 10th Gen delivers the fastest UFS programming performance in the industry achieving up to 440MB per second Read and 201MB per second Write. First-part time is accelerated because UFS programming can commence without pausing for data to download.

The BPM310 is positioned to outperform higher-priced systems and includes advanced features such as WhisperTeach, on-the-fly vision alignment, CSP support, serialization, encryption, and JobMaster while providing true universal technology. 10th Gen supports the broadest range of devices including MCUs, eMMC, NAND, Serial Flash, UFS, and others. Highly configurable, the BPM310 provides options for Tape I/O, Tray I/O, Tube I/O, laser marking, and 3D inspection. 

“Our engineering team has done an amazing job creating the most powerful universal programmer in the industry. Unlike competitive products, our system offers true universal support including CSP, Flash, MCUs, eMMC, and UFS with up to 8 sockets per site to deliver unbeatable system value,” says William White, founder and CEO of BPM Microsystems. “The BPM310 is now our flagship product with the greatest capacity, flexibility, features, reliability, and smallest footprint in our product line.”

“We’re excited to showcase the BPM310 at Productronica and anticipate a positive market response,” says Colin Harper, Global Sales Director at BPM. “In the past, we have demonstrated two machines at the trade show. Now we have one system that can do it all. In fact, the BPM310 is able to program as many devices concurrently as our larger system, the 4910, in a footprint about half its size while offering the same I/O flexibility and improved reliability.”

The BPM310 leverages much of the socket adapter and algorithm development currently available on its 9th Generation systems. And like all 9th Gen automated programmers, the BPM310 continues to offer ease of operation and fast setup with award-winning BPWin process control software and patented WhisperTeach. WhisperTeach automatically teaches the critical Z-height of each pick/place location with 15-micron accuracy. Accurate automated teaching is vital for small packages due to fundamental human limitations. Plus WhisperTeachTM saves an average of 83% of the time required for the job setup compared to traditional methods while increasing quality and yield.

BPM310 Automated Programmer BrandingBPM manufactures its 10th Generation systems in their ISO 9001:2015 certified plant located in Houston, Texas, and their products carry the CE Mark. BPM continues to offer 9th Generation programmers for manual and automated programming. If you are at Productronica 2021, visit Hall A1-353 from November 16 through 19, 2021 to see a live BPM310 demo. For more information on the BPM310, go to www.bpmmicro.com/BPM310.

End of Life for 6th, 7th, 8th Gen CyberOptics Alignment Sensor

End of Life for 6th, 7th, 8th Gen CyberOptics Alignment Sensor

Obsolescence of CyberOptics Alignment Sensor used on legacy BPM Automated Programming Systems

CyberOptics ceased manufacturing the alignment sensor used on the BPM Microsystems’ 6th through 8th Generation automated programming systems in 2014. Prior to that date, BPM Microsystems invested significantly in a “last time buy” opportunity. During the almost 8 years since the last purchase, all of BPM’s inventory is depleted.

As of March 14, 2022, BPM can no longer repair damaged legacy CyberOptics cameras.

Modern 9th and 10th Generation CyberOptics cameras are available for purchase and repair.

BPM understands the critical nature of this alignment sensor. Today, BPM provides opportunities for the purchase of refurbished replacement sensors through a non-warranty core exchange process. This process requires that “broken” sensors (the core) be sent to BPM for repair. However, not all sensors can be repaired. Therefore even this inventory is almost exhausted.

We highly recommend that all 8th Gen Automated Programmer users consider a strategy to systematically trade-in these legacy systems for modern, more productive BPM APS models. As a start BPM will provide a proposal for the trade-in of your legacy BPM APS and will be providing further recommendations for your other machines.


APS 6th Generation APS 7th Generation APS 8th Generation APS
3000 Series 3600, 3610 3700MK2, 3710MK2 3000FS, 3800
4000 Series 4600, 4610 4700, 4710 4800

 

BPM Support for eMMC Devices in HS400 Mode

BPM Support for eMMC Devices in HS400 Mode

HS400 mode significantly increases programming speeds on eMMC devices, especially compared to other programming modes. HS400 programming mode enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput.

Manufacturer/Device Package 9th Gen Socket Purchase Online
Hynix Semiconductor H26M41208HPR (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Hynix Semiconductor H26M41204HPR (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Kingston EMMC04G-W627-X03U (HS400) BGA(153) Yes FVE4ASML153BGL*, FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Micron MTFC4GACAJCN-1M WT (HS400) BGA(153) Yes FVE4ASML153BGL*, FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
SanDisk SDINBDG4-16G (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Samsung KLMAG1JETD-B041 (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Samsung KLM4G1FETE-B041 (HS400) BGA(153) Yes FVE4ASMC153BGR Yes
SkyHigh S40FC004C1B1C0000 (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes

*HIC Socket (high capacity)


New eMMC Support for HS400 Mode

Hynix Semiconductor H26M41208HPR (8/3/2021)

Device Parameters

  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Hynix Semiconductor H26M41204HPR (8/3/2021)

Device Parameters

  • 8-bit Bytes: 8804892672
  • Memory Regions: 0h-1 EFA7 FFFFh; 1 EFA8 0000h-2 0CCF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Kingston EMMC04G-W627-X03U (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4270325760
  • Memory Regions: 0h-F063 FFFFh; F064 0000h-FE87 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASML153BGL (HIC Socket), FVE4ASMC153BGJ, FVE4ASMC153BGZ

Micron MTFC4GACAJCN-1M WT (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4402446336
  • Memory Regions: 0h-F7D3 FFFFh; F7D4 0000h-1 0667 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASML153BGL (HIC Socket), FVE4ASMC153BGJ, FVE4ASMC153BGZ

SanDisk SDINBDG4-16G (8/3/2021)

Device Parameters

  • 8-bit Bytes: 17737187328
  • Memory Regions: 0h-3 E67B FFFFh; 3 E67C 0000h-4 2137 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 16 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Samsung KLMAG1JETD-B041 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 17597988864
  • Memory Regions: 0h-3 DEA5 FFFFh; 3 DEA6 0000h-4 18EB FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 16 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Samsung KLM4G1FETE-B041 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4407164928
  • Memory Regions: 0h-F817 FFFFh; F818 0000h-1 06AF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGR

SkyHigh Memory S40FC004C1B1C0000 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4407164928
  • Memory Regions: 0h-F817 FFFFh; F818 0000h-1 06AF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ
BPM’s File Builder Wizard makes eMMC Programming Easy

BPM’s File Builder Wizard makes eMMC Programming Easy

eMMC File Concatenate Wizard Saves Time, Streamlines Workflow, Reduces Errors



BPM Microsystems have the best programmers, especially when it comes to complex microprocessors and high-density eMMC devices. BPM’s 9th Generation universal programmers offer the fastest flash programming times, as well as the widest universal device coverage, all in a single, universal programming site. With over 40,000 supported devices, there’s no one else that comes close.

eMMC devices have large, complex data patterns (4GB and up) that can be difficult to set up and prone to operator error. Previously, you had to manually load each eMMC data pattern one by one through the buffer loader. Depending on the complexity, this step was repeated three or more times. Each data pattern also required a manual calculation of data offsets, with no way to provide the checksum. As eMMC devices have gotten larger, the technical challenge of the file structure has become more complicated.

That is, until now.

Now, you can use the configuration information (which should be provided with the eMMC device) to streamline your workflow, eliminate errors, and simplify set-ups. Utilizing a Microsoft Excel template, you can easily streamline file formatting by giving you one document to capture the specifics of the eMMC project, and then utilizing parts of it for the automation tool. The template can also be shared with 3rd parties or saved as a historical record of the project specifications.

On average, the eMMC Wizard should only take a few minutes to edit the data template, and about 10 minutes for the tool to create the data pattern. While the file is outputting, the tool automatically calculates the checksums and verifies them on the fly. Multiple checksum options are available from the pull-down in the Excel template. It also replaces the manual calculation for each offset with an automated calculator, reducing the possibility of errors.

eMMC File Builder Wizard

In order to use the eMMC File Concatenate Wizard, you’ll need the latest version of BPWin, which can be downloaded here. (If your Software contract is expired, you may need to renew it; contact Inside Sales).

All new eMMC algo development will use a standard template that supports the file Wizard. In some cases, older algorithms will not be compatible. Please enter a Device Support request if you need an update to a legacy algorithm that is not currently compatible with the Wizard. If an algo does not support it (yet), you will be presented with this message:

You can submit a device support request here.

eMMC Wizard Example

In this example, we’ll use a Samsung eMMC with HS400 support. Select the Samsung KLMAG1JETD-B041 device/algo in BPWin. Then navigate to the File Concatenation tool via either the “Device” menu in the BPWin toolbar or by clicking the “Device Config” button, followed by “File Concatenation“.

You will now be asked to select an input configuration file and an output location. Select the output location for your concatenated file.

The input will need to be a filled-out Excel sheet, based on the template found here. Fill out the GP_SIZE_MULT_X fields (provided by the semi house), and the list of files, offsets, and checksums below. Don’t forget to select a specific checksum type from the dropdown menu, or the tool will not know how you want the checksum calculated.

Here are some examples of filled-out templates:

(Since the template requires user-inputted paths to the specified files, you need to ensure that the files are actually located there.)

Once you have selected an input configuration file and output location, click “Concatenate” and wait for the operation to finish. In the end, there should be an “output.bin” file located in the folder you specified earlier.

The green status bar will let you know your file is processing. Depending on file size, this may take several minutes

The concatenate wizard takes a few minutes to finish. If you are utilizing HS200 or HS400, you’ll still need to run the file through the image format tool– navigate via either the “Device” menu in the BPWin toolbar or by clicking the “Device Config” button, followed by “image format“ (remember, this is for HS200/400).

That’s it!

In summation, the eMMC File Wizard makes eMMC programming much easier and faster by walking through the steps to quickly build your files. This ensures quality programming results from first article qualification through production.

The eMMC File Concatenation Wizard is available with BPWin Version 7.0.7 and later. If you have any questions, please reach out to our Technical Support team. If you need to update your software agreement, please contact Inside Sales.