HOUSTON, TX–(U.S. Tech)–Oct. 26, 2017– BPM Microsystems will demonstrate its new 4900 automated memory programming system at Productronica, scheduled to take place November 14 – 17, 2017 in Munich, Germany. The 4900, with its advanced chip-scale part (CSP) device handling, on-the-fly vision alignment, and HS400 programming speeds, satisfies a vast range of programming needs in one automated system. Featuring high-performance laser marking and 3D inspection, the 4900 provides advanced serialization and quality control, meeting the highest programming and cyber security standards for automotive, aerospace, medical, industrial and mobile device industries.
The 4900 is powered by the newest BPM 9th generation technology. This technology programs eMMC in HS400 mode, the highest speed mode available, as well as HS200, DDR and SDR. The 4900 supports a high-mix of devices on the same site, including microcontrollers, FPGA, eMMC, NAND, NOR and Serial Flash, delivering speed and versatility on one system.
Innovations for advanced CSP device handling include BPM patent-pending WhisperTeach™ technology, which fully automates teaching the smallest CSP devices. A new camera delivers vision alignment across the x, y, and z axes, to accurately align small devices while in motion. The new alignment and positioning capabilities of the 4900 allow it to operate at full speed when handling CSP devices.
The 4900 introduces a new hybrid laser that combines fiber and Nd:YAG laser technologies for precision marking quality. Built-in mark verification and laser power monitoring at the point of mark ensure a consistent, damage-free mark on every device. The integrated 3D Inspection system completes the 4900 by delivering full device package validation after programming. The 3D Inspection checks BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors. 3D Inspection ensures each device meets specifications resulting in higher quality devices and lower overall costs.
BPM Microsystems announces double data rate (DDR) support for eMMC flash memories on 8th Generation programmers. The 8th Generation programmers already featured the fastest programming and verification times of any universal programmers. This new feature doubles the rate at which data is transferred into and out of the device during programming and verification by transferring a word of data to or from the device on both the rising and falling clock edges.
“Our automotive customers’ programming enormous data files will get an immediate increase in productivity by using DDR,” said William White, CEO of BPM Microsystems. “The programmers we are shipping today are now more than 1,000,000 times faster than the original EP-1 programmer we shipped 30 years ago.”
“The Vector Engine BitBlast DDR Mode Support is just the latest example of how the advanced Vector Engine design sets us apart from the competition. The Vector Engine continues to evolve and adapt to new requirements keeping our users up to date even as their requirements change.”
As an example of the performance that can be achieved with this new feature, 2800 and 3800MK2 programmers are now a staggering 105% faster than the closest competitor on the SanDisk SDIN8DE4-32G. The BPM programmer will perform a Program and Verify operation in 1403 seconds when programming 29GB of random data compared to 2880 seconds for the Flash Core III according to Data I/O’s website. The 3800MK2 will program and verify this device at a rate of 1190 GB/hour, enabling economic programming of enormous data patterns used in today’s automotive electronics.
By decreasing programming times, BPM has enabled customers with the 3800MK2 to achieve the devices per hour similar to competitive machines that are more than twice the footprint. In addition to the improved cost per device, the faster programming times mean that when using High Insertion Count Sockets (HIC Sockets), which can have lifetimes of up to 1 million insertions, customers only have to buy half as many sockets to get the same throughput in devices per hour. Such reductions can potentially save hundreds of thousands of dollars over the life of a machine.
All users of the 8th generation programmers that are under software contracts are eligible for a free automatic firmware update that will enable this new feature automatically when the BPWin software is updated.
Established in 1985, BPM Microsystems is known for its long history of disruptive innovation including the first universal programmer with socket modules, the first concurrent programmer, the first automated programming system with vision centering, the first flash programmer with Vector Engine and DDR and the first high-yield CSP programming system. BPM presently leads the programming industry with automated programming of CSP devices, fast programming times, rapid support for complex integrated circuits and productivity.
HOUSTON — Feb. 14, 2013 — BPM Microsystems announces that its model 3800 automated programming system is now available with a side-mount option for the V-TEK TM-50 tape output media. This reconfiguration offers additional flexibility by allowing the machine to utilize options for tape, tray, tube and marking simultaneously.
“There are a number of advantages to the side-mount option that include improved access to the machine’s sites, less changeover time between jobs with the use of multiple input and output media, and reduced operator attendance,” said Colin Harper, director of sales and marketing. “With these advantages, our customers who opt for this configuration will ultimately see an increase in the number of programmed parts, thus reducing the overall cost per device.”
BPM Microsystems introduced the 3800 in 2010 as the fastest universal device programming solution on the market. It combines the company’s 8th Generation universal programming technology with the speed of the Vector Engine Co-Processor®, which is capable of achieving a peak operating rate of 25 Gbits per second.
The 3800 can be configured to accommodate the standard front-mount or new side-mount option for the TM-50 carrier tape packaging solution. The new configuration will be on display in the company’s booth #108 next week at the IPC APEX Expo in San Diego, CA.