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Productronica 2021 by the Numbers

Productronica 2021 by the Numbers

Productronica 2021 ends with about 20,000 visitors and 894 exhibitors from 36 countries (including BPM), underscoring its position as a leading trade fair for the electronics industry.  While those numbers are down from previous shows, there was much pent-up interest. Those who were there were eager to see what’s new. Read more here.

The new BPM310 10th Generation Automated Programmer ran flawlessly. Final numbers for the demo: 1,200 Devices per Hour (DPH) on four 10th Gen Sites with 32 sockets tray-to-tray (TS1500 Tray Stacker). The benchmark devices were BGA153s with a programming time of 38 seconds. By the fourth day of Productronica, the BPM310 cycled through over 30,000 devices! The BPM310 has a maximum configuration of 48 sockets on a smaller platform, with a maximum DPH of 1,432. The BPM310 can be configured with advanced peripherals, such as 3D inspection and fiber laser marker.

“Another Productronica is in the record books,” says Colin Harper, Global Sales Director at BPM. “A big thanks to Adaptsys (BPM’s European Distributor) for another successful show. And thank you to all the visitors that stopped by to see our new universal automated programming system, the BPM310. We’re looking forward to furthering engagement. Prost!”

The BPM310 was received well by numerous electronics manufacturers, who are interested in bringing programming in-house. They are excited by the prospect of a small platform with maximum capacity, including high-density devices, such as eMMC, UFS, and Microcontrollers without the need for multiple site types.

Next Productronica, which happens every two years, will be November 14-17 2023.

Productronica– Day 2

Productronica– Day 2

Day 2 is in the books: more traffic and lots of excitement for BPM’s latest innovation, the BPM310 Automated Programmer. Automotive, Contract Manufacturers and Consumer Electronics companies are among those interested.

The BPM310 is positioned to outperform higher-priced systems and includes advanced features such as WhisperTeach™, on-the-fly vision alignmentCSP supportserializationencryption, and JobMaster while providing true universal technology. 10th Generation site technology supports the broadest range of devices including MCUs, eMMC, NAND, Serial Flash, UFS, and others. Highly configurable, the BPM310 provides options for Tape I/O, Tray I/O, Tube I/O, laser marking, and 3D inspection.

Productronica in Munich Germany is the second-largest electronics trade show in the world and continues through November 19, 2021.

Learn about BPM310 | US Tech Article | BPM310 Press Release

BPM Microsystems Launches the BPM310– 10th Generation Universal Automated Programming System with 48 sockets and UFS Support

BPM Microsystems Launches the BPM310– 10th Generation Universal Automated Programming System with 48 sockets and UFS Support

BPM Microsystems, Inc. announces the release of its 10th Generation programming technology platform and the BPM310 Automated Programming System. The 10th Generation offers the industry’s fastest programming times for UFS, eMMC, Flash, and MCUs with twice as many sockets per site as its predecessor. The BPM310 offers a capacity of up to 48 sockets, automotive-level quality, and reliability in a small footprint. 10th Gen delivers the fastest UFS programming performance in the industry achieving up to 440MB per second Read and 201MB per second Write. First-part time is accelerated because UFS programming can commence without pausing for data to download.

The BPM310 is positioned to outperform higher-priced systems and includes advanced features such as WhisperTeach, on-the-fly vision alignment, CSP support, serialization, encryption, and JobMaster while providing true universal technology. 10th Gen supports the broadest range of devices including MCUs, eMMC, NAND, Serial Flash, UFS, and others. Highly configurable, the BPM310 provides options for Tape I/O, Tray I/O, Tube I/O, laser marking, and 3D inspection. 

“Our engineering team has done an amazing job creating the most powerful universal programmer in the industry. Unlike competitive products, our system offers true universal support including CSP, Flash, MCUs, eMMC, and UFS with up to 8 sockets per site to deliver unbeatable system value,” says William White, founder and CEO of BPM Microsystems. “The BPM310 is now our flagship product with the greatest capacity, flexibility, features, reliability, and smallest footprint in our product line.”

“We’re excited to showcase the BPM310 at Productronica and anticipate a positive market response,” says Colin Harper, Global Sales Director at BPM. “In the past, we have demonstrated two machines at the trade show. Now we have one system that can do it all. In fact, the BPM310 is able to program as many devices concurrently as our larger system, the 4910, in a footprint about half its size while offering the same I/O flexibility and improved reliability.”

The BPM310 leverages much of the socket adapter and algorithm development currently available on its 9th Generation systems. And like all 9th Gen automated programmers, the BPM310 continues to offer ease of operation and fast setup with award-winning BPWin process control software and patented WhisperTeach. WhisperTeach automatically teaches the critical Z-height of each pick/place location with 15-micron accuracy. Accurate automated teaching is vital for small packages due to fundamental human limitations. Plus WhisperTeachTM saves an average of 83% of the time required for the job setup compared to traditional methods while increasing quality and yield.

BPM310 Automated Programmer BrandingBPM manufactures its 10th Generation systems in their ISO 9001:2015 certified plant located in Houston, Texas, and their products carry the CE Mark. BPM continues to offer 9th Generation programmers for manual and automated programming. If you are at Productronica 2021, visit Hall A1-353 from November 16 through 19, 2021 to see a live BPM310 demo. For more information on the BPM310, go to bpmmicro.com/BPM310.

BPM Support for eMMC Devices in HS400 Mode

BPM Support for eMMC Devices in HS400 Mode

HS400 mode significantly increases programming speeds on eMMC devices, especially compared to other programming modes. HS400 programming mode enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput.

Manufacturer/Device Package 9th Gen Socket Purchase Online
Hynix Semiconductor H26M41208HPR (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Hynix Semiconductor H26M41204HPR (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Kingston EMMC04G-W627-X03U (HS400) BGA(153) Yes FVE4ASML153BGL*, FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Micron MTFC4GACAJCN-1M WT (HS400) BGA(153) Yes FVE4ASML153BGL*, FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
SanDisk SDINBDG4-16G (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Samsung KLMAG1JETD-B041 (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Samsung KLM4G1FETE-B041 (HS400) BGA(153) Yes FVE4ASMC153BGR Yes
SkyHigh S40FC004C1B1C0000 (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes

*HIC Socket (high capacity)


New eMMC Support for HS400 Mode

Hynix Semiconductor H26M41208HPR (8/3/2021)

Device Parameters

  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Hynix Semiconductor H26M41204HPR (8/3/2021)

Device Parameters

  • 8-bit Bytes: 8804892672
  • Memory Regions: 0h-1 EFA7 FFFFh; 1 EFA8 0000h-2 0CCF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Kingston EMMC04G-W627-X03U (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4270325760
  • Memory Regions: 0h-F063 FFFFh; F064 0000h-FE87 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASML153BGL (HIC Socket), FVE4ASMC153BGJ, FVE4ASMC153BGZ

Micron MTFC4GACAJCN-1M WT (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4402446336
  • Memory Regions: 0h-F7D3 FFFFh; F7D4 0000h-1 0667 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASML153BGL (HIC Socket), FVE4ASMC153BGJ, FVE4ASMC153BGZ

SanDisk SDINBDG4-16G (8/3/2021)

Device Parameters

  • 8-bit Bytes: 17737187328
  • Memory Regions: 0h-3 E67B FFFFh; 3 E67C 0000h-4 2137 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 16 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Samsung KLMAG1JETD-B041 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 17597988864
  • Memory Regions: 0h-3 DEA5 FFFFh; 3 DEA6 0000h-4 18EB FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 16 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Samsung KLM4G1FETE-B041 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4407164928
  • Memory Regions: 0h-F817 FFFFh; F818 0000h-1 06AF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGR

SkyHigh Memory S40FC004C1B1C0000 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4407164928
  • Memory Regions: 0h-F817 FFFFh; F818 0000h-1 06AF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ
HS400 Programming Improves eMMC Performance

HS400 Programming Improves eMMC Performance

According to the JESD84-B51 standard, eMMC v5.1 supports the following bus speed modes and clock frequencies:

Mode

Data
Rate

I/O Voltage

Bus Width
(bits)

Frequency

Max. Data Transfer 

HS400 Dual

1.8/1.2 V

8

0-200 MHz

400 MB/second

HS200

Single

1.8/1.2 V

4, 8

0-200 MHz

200 MB/second

High-Speed DDR

Dual

3/1.8/1.2 V

4, 8

0-52 MHz

104 MB/second

High-Speed SDR

Single

3/1.8/1.2 V

1, 4, 8

0-52 MHz

52 MB/second

HS400 mode significantly increases programming speeds on eMMC devices, especially compared to other programming modes. HS400 programming mode enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput.

BPM has recently added support for the following eMMC devices in HS400 Programming Mode:

Manufacturer/Device Package 9th Gen Socket Purchase Online
SanDisk SDINBDG4-8G (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Samsung KLMCG2KCTA-B041000 (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Micron MTFC32GAKAEJP-AIT (HS400) BGA(153) Yes FVE4ASMC153BGZ
Micron MTFC32GAKAECN-4M IT (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRQ (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRN (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRI (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRA (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes

HS400 Programming Mode

SanDisk SDINBDG4-8G (6/22/2021)

SanDisk SDINBDG4-8GDevice Parameters

  • Manufacturer: SanDisk (ID=45h)
  • Part Number: SDINBDG4-8G (HS400) (ID=3038h)
  • 8-bit Bytes: 8807030784
  • Memory Regions: 0h-1 EFC6 CFFFh; 1 EFC6 D000h-2 0CF0 9FFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Samsung KLMCG2KCTA-B041000 (6/22/2021)

Device Parameters

  • Manufacturer: Samsung (ID=15h)
  • Part Number: KLMCG2KCTA-B041000 (HS400) (ID=3432h)
  • 8-bit Bytes: 70354206784
  • Memory Regions: 0h-F 7877 FFFFh; F 7878 0000h-10 616F FE1Fh; 10 616F FE20h-10 6170 003Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 64 GByte
  • Socket: FVE4ASMC153BGJ

Micron MTFC32GAKAEJP-AIT (6/22/2021)

Micron-MTFC32GAKAEDevice Parameters

  • Manufacturer: Micron (ID=13h)
  • Part Number: MTFC32GAKAEJP-AIT (HS400) (ID=374Ch)
  • 8-bit Bytes: 35181822048
  • Memory Regions: 0h-7 BC7F FFFFh; 7 BC80 0000h-8 30FF FE3Fh; 8 30FF FE40h-8 3100 005Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 32 GByte
  • Socket: FVE4ASMC153BGZ

Micron MTFC32GAKAECN-4M IT (6/22/2021)

Micron-MTFC32GAKAE

Device Parameters

  • Manufacturer: Micron (ID=13h)
  • Part Number: MTFC32GAKAECN-4M IT (HS400) (ID=374Ch)
  • 8-bit Bytes: 33218887808
  • Memory Regions: 0h-7 4DFF FFFFh; 7 4E00 0000h-7 BBFF FE5Fh; 7 BBFF FE60h-7 BC00 007Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 32 GByte
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRQ (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRQ (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 Gig
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRN (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRN (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRI (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRI (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRA (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRA (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ
BPM Releases Support For Renesas Automotive Microcontroller

BPM Releases Support For Renesas Automotive Microcontroller

BPM Releases Support For Renesas Automotive Microcontroller

Renesas R7F7015433AFP-C for Automotive Electrical Body Applications

The RH850/F1K is one group of single-chip microcontrollers in the RH850/F1x series which is designed for automotive electrical body applications. While it achieves low power consumption, the internal flash memory ranges from 768KB to 2MB and the package covers a wide range from 100 to 176 pins. Also, a CAN FD interface has been added (premium products only) and the CPU operating frequency has been improved to 120MHz. See more here.

  • Renesas R7F7015433AFP-CPackages: QFP(144)
  • Category: MCUs and MPUs – RH850 Family (Automotive only) – RH850/F1K
  • Device Type: 32-bit G3M CPU core
  • Device Size: 2MBytes Code Flash + 32KBytes User Area + 64KBytes Data Flash
  • Algorithm Programming Method: 3-Wire Serial I/O Mode
  • 9th/8th Gen Socket Solution: FVE2ASM144LQFPA
  • Available on BPM’s Process software BPWin Versions released after 01/14/2021
  • Note: Replaceable burn-in test socket

Unique Support

As of publication, BPM has the only supported solution for this particular device. Renesas devices currently supported by BPM stand at 1,762.

  Supported* Socket
Elnec No  
Data I/O No  
Dediprog No  
BPM Yes FVE2ASM144LQFPA

*As of publication

9th Gen

9th Generation Site Technology delivers the fastest programming times, 2 to 9 times faster for flash devices. Vector Engine Co-processing with BitBlast offers the fastest programming speeds in the industry, vastly increasing throughput.

FVE2ASM144LQFPABPM Advantages

The socket card (FVE2ASM144LQFPA) is built with a replaceable burn-in test socket. This means when the socket wears out, simply remove it and replace it with LSOCQ144EA-2, rather than replacing the whole socket card (adapter). This socket allows for up to 2 devices to be programmed in parallel and will work with both manual and automated systems on 9th and 8th Gen systems.

BPWin Software Support

In order to fully take advantage of new device support from BPM Microsystems, you’ll need a version of BPWin after 1/14/2021. All engineering manual programmers (they start with a “1” such as the 1710) come with lifetime software support. New programmers come with one year of software support; if your software contract has lapsed, please contact Inside Sales to take advantage of daily additions and improvements in device support.

Number of Devices Supported by 9th Gen

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