by BPM Webmaster | Mar 23, 2020 | Case Study, How To, White Papers
From a time, cost and personnel perspective, it’s easier than you think
Moore’s law (Moore’s law is the observation that the number of transistors in a dense integrated circuit doubles about every two years (see https://en.wikipedia.org/wiki/Moore%27s_law) )states integrated circuits double in both speed and number of circuits roughly every two years. As programmable devices become smaller, denser, and more complex, most machines that program those devices have become more expensive, and require experienced technicians to operate, maintain and troubleshoot.
The downside to outsourcing programming are legion: added cost, minimum orders, long lead time, and reprogramming or scrap when data files change. Another danger is protecting your intellectual property. Once your source code leaves the vault in your factory, it is vulnerable to theft (This is not a concern if you’re using a reputable programming house in your home country or region. If your source code crosses a border, you’re putting your company at risk. ) Due to current market conditions, companies are increasingly concerned about interruptions in the supply chain, especially for components sourced from Asia.
Until recently, it wasn’t feasible for most Original Equipment Manufacturers (OEMs) with significant programmed device requirements (A good ball-park for an automated programmer is in excess of 50K devices per month. ) to justify the cost of bringing programming in-house. Automated Programming Systems (APS) were expensive and complex to set-up, run and maintain. That’s when BPM changed the game.
A short history lesson
BPM Microsystems started making EPROM programmers in the mid-80s. BPM’s Founder Bill White was a student at Rice University, working on his degree in Electrical Engineering. He needed a way to get his code on a read-only chip, and discovered there just wasn’t a good way to do it. So, he built his own programmer. While he was still living in the dorm, he started selling his programmer, the EP-1, by mail order, and BPM Microsystems was born. BPM has a history of simple-to-operate, reliable systems that deliver the industry’s best results.
BPM launched its first automated programmer in the mid-90s: the BPM 4100 was the only universal fine-pitch automated pick-and-place programming system. Compared to today’s machines, it was slower and more difficult to set up (and operated in DOS). Compared to the single-purpose machines of that day, the 4100 revolutionized device programming by combining universal programming technology with universal fine-pitch handling capability.
Holy Grail of Device Programming
The “holy grail” of consistent automated programming results is the Z-axis teach. There are three axes on an automated handler: X, Y, and Z (Theta is the 4th “axis” which determines the precise orientation of the device (rotation)). X (horizontal) and Y (vertical) are easy; a downward camera with a bomb site allows for precise placement on the center of a device. The Z (up/down) is, by far, the most difficult and the most important. Both the pick and place locations, if off by less than the width of a human hair, can cause major problems. Manually-adjusted z-teach can go badly two ways: pick (or place) too high can cause misalignment of the device; place (or pick) too low, where the nozzle comes in contact with the device, can cause micro-cracks. Devices with micro-cracks usually pass the initial test (green light), but can oxidize the sensitive metal film causing devices to fail in the field.
BPM is the first to solve the Z-axis conundrum with a patent-pending solution called WhisperTeach. It utilizes hardware and software to turn the device nozzle into a sensor. Without coming in contact with the device, the automated system detects the height of the device to within 15 microns (4 times finer than a human hair) and automatically completes the “teach” in less than 8 seconds. A trained technician, although not as accurate as WhisperTeach, can teach a single location in about a minute. On a single job set-up, the difference in time is dramatic: WhisperTeach set-up is usually around 5 minutes; manual teach can take up to 45 minutes to an hour. When you add the loss of productivity to the reduction in precision, things can quickly get dicey. Regardless of which programmer, pick-and-place systems are incredibly repeatable: if the teach is off by a little, the pick/place will be consistently off as well.
WhisperTeach is available on all BPM automated systems, not just on its high-end systems.
Bringing it Home
Since about 2010, the strongest market segment for Automated Programmers has been Automotive suppliers. Automotive suppliers have an ever-increasing need for programming as cars become more complex and technology-driven. They also often require 3D inspection and laser marking to ensure consistent quality and to track inventory. Big projects, with millions of programmed devices, make device programming in-house a no-brainer.
Smaller OEMs, while perhaps having many of the same needs as the Automotive guys, were constrained by limited resources. As their programming needs outgrew their ability to produce on manual systems, the only option was to outsource to the programming houses or ship their component manufacturing off-shore.
Then came the perfect storm of 2019: a crippling trade war, followed by a growing pandemic.
OEMs recognize the risk in outsourcing critical components, such as programmed devices, to off-shore suppliers. They are looking more closely at options that reduce their reliance on forces beyond their control in a way that reduces costs and speeds go-to-market.
BPM has a history of innovation; they also have a reputation as the “luxury brand” in device programming– feature-rich, and pricy, especially when compared to low-cost Asian machines. That changed with the launch of the 3901, the lowest cost full-featured automated system with vision centering (Precisely center the device (even if the operator is slightly off) and affect the theta spin while traveling to the site location, which delivers incredibly precise placement without the need to slow down) and true universal support (Only BPM has the same site technology, same software, same sockets and algorithms in all of their 9th Generation programmers. With over 35,000 supported devices, including the most difficult and mission-critical, no one in the industry comes close.). The 3901 starts at under $90,000 with a maximum configuration of 16 device sockets (Sockets are specific to the device they program and act as the bridge between the device and the programmer).
Within 10 days of the 3901 launch in October of 2019, the first machine sold to a telecommunications OEM in the Northeast US. The second soon sold to a Midwest heavy equipment manufacturer. Both companies needed an affordable system that can supply their catalog of programmed devices to their lines. The 3901 quickly became the fastest-selling automated system in BPM’s 35-year history. Equipment manufacturers, especially those in North America and Europe/Middle East, finally have a lower-cost option for their device programming needs without sacrificing quality and capability.
With the launch of the seven-site 3928 in November 2019, companies have access to automotive-level quality (available 3D inspection) with up to 28 sockets in a fully-loaded system that starts at just under $110,000.
Hot buttons for OEMs
- Faster time to market– go from prototype to production in weeks, not months.
- Expand vertical manufacturing capability
- React to design changes quickly– tweaks in code can be updated to the workflow in just a few minutes
- Intellectual Property physically protected from theft (This is one of the reasons BPM has maintained a technology advantage over their competitors. The “secret sauce” source code stays locked at BPM’s campus in Houston, Texas USA, where they still build all of their systems.)
- Don’t have to shut down the line due to supply chain issues with programmed devices
- Device programming is easier than ever before; Installed and operational in less than one week
- Manual programmers can provide 10s of thousands of devices per year; when demand exceeds manual capacity, it’s easy to migrate to an automated system (same sockets, software, no need to redo first article, etc.)
- One high-speed universal platform can support millions of devices per year, at an incredibly low cost per device
- As demand increases, it’s easy to add additional sites for more capacity. If additional capacity is needed, add additional shifts without needing highly skilled technicians
- Lower cost solutions (3901, 3928) provide the greatest value in the industry. ROI in months, not years.
Conclusion
You can’t control world events– what you can do is provide your manufacturing team with an uninterrupted supply of high-quality, low cost programmed devices. To find out more about how BPM is changing device programming for OEMs, please call us at +1 (713) 263-3776, or Toll-Free in the US: (855) SELL BPM. Ask us about the industry’s only self-installation for APS that’s fast, easy, and free.
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by BPM Webmaster | Feb 7, 2018 | Case Study, News, Technology, White Papers
CSP Device Programming Strategies for the C-Suite
Good things come in small packages, but small packages can be tricky and costly to handle. The trend for higher density devices and smaller package sizes creates a unique set of challenges for the programming centers and manufacturers programming those devices. A light puff of air sends small parts flying, and misalignment of less than .2mm creates placement issues. This article shares best practices decision makers should consider when purchasing or upgrading production equipment to program small IC devices to maximize speed, quality and cost savings.
The rise in demand for small device packages
Mobile phones, PDAs, and other mobile products continue to take on new roles such as digital camera, video camera, and TV receiver. These functions require an increased number and greater variety of semiconductors in order to operate, while consumers want their finished products in ever-smaller form factors. Thus, as mobile phone sales have soared, demand for the chip-scale package (CSP) has increased faster than any other IC package type over the past decade or so. The demand for smaller packages with higher densities affects other segments including automotive, industrial, medical device and Internet-of-Things. As the need for complex electrical circuits increases, programmed devices are developed in smaller and smaller packages to free up much-needed space in circuit design. As a result, programming centers and manufacturers are moving towards purchasing or retrofitting existing pick and place machines that are capable of programming such devices with little or no device failures.
Manufacturer challenges handling small devices
Pick and place errors account for the majority of quality issues when programming small devices. Pick and place inaccuracy occurs when the machine is not taught precisely or is inaccurately placing parts due to unaccounted longer x-y axis settling times before a place. Teaching the z-height for a machine manually is nearly impossible for small devices, and for larger devices, operator skill and experience are required. Programming centers and manufacturers incur added costs for labor, machine idle time, lost devices, damaged devices, escapes, and poor yield.
Process control improvements
Automated IC device programmers lift and move devices using a vacuum nozzle attached to a robotic machine to perform repetitive operations. The negative pressure lifts the object and holds it against the nozzle while moving it to the desired location and then setting it into place. However, very small objects, such as small computer or digital chips, including Wafer Level Chip Scale Packaging (WLCSP), small-outline transistors (SOT), and dual-flat no-leads (DFN), may be lifted by the nozzle prior to contact by the nozzle with the object. The vacuum may cause the object to “jump” up to the nozzle.
Operators using process control software teach the robotic machine the height of the object before it begins repetitive production operations. When setting up a job, operators use the process control software to teach the robotic machine the location (x, y, and z) of the input media, output media, peripherals, and programming site and socket. To teach z-height, the operator depresses the nozzle on the handler until it just touches the device. With IC device packages getting smaller, reaching .305mm thick and sizes of 1.7mm x 1.4mm, manually teaching the z-height of the device into the socket is nearly impossible. An operator cannot clearly see deep into the socket to see when the nozzle touches the device. With a flashlight and the assistance of a co-worker, multiple attempts and adjustments occur to determine the z-height.
During a teach cycle, the jump by the device causes the height to be measured incorrectly by the robotic machine that moves the nozzle. Subsequently, during repetitive operations, this incorrect height causes the machine to attempt to pick up the object before making contact. This leads to pick and place errors, dropped parts, cracked parts, and continuity errors. If alignment is off by even .2mm, the teach process must be repeated to avoid cracking or otherwise damaging the device.
Customers report manual teaching small devices takes up to 30 minutes per station. For programming centers with five changeovers per day, this costs 2.5 hours machine idle time plus the costs of labor and lost or damaged devices. Programming centers and manufacturers should consider process control software and equipment with automated teaching capabilities for small parts. For example, BPM Microsystems WhisperTeach™ automates the task for the operator. It completes the task in 4.37 minutes with a standard deviation of 0.5mils, resulting in a savings of up to 25.63 minutes per station or 2.14 hours per day with five changeovers per day.
Accurately taught jobs improve yield by eliminating pick or place errors. Customers have reported yields as poor as 80% on very small parts using manual teach depending on operator skill. Process control software with automated z-height teaching produces a job yield of 99.99% by eliminating any teach related issues.
Production control efficiencies
After completing the job setup and production begins, the accuracy of placement is critical to avoid damaging the device. Manufacturers need to ensure their systems self-calibrate z-height during production to eliminate the need for manual adjustments to compensate for variations in atmospheric pressure, nozzle size, flow rates, filter conditions, and more. This self-calibration by the machine ensures accurate handling throughout the job. In addition to an intelligent process control software and pneumatics systems, look for systems equipped with a high-quality vision system to ensure proper alignment of small parts before placement at each station. When integrated with the production software, vision systems allow the machine to align the device while in motion at high speeds.
For small parts, placement accuracy can be a challenge for systems that are unable to settle their x-y motion fast enough. Look for systems with designs allowing them to operate at maximum throughput without having to slow down the system to handle small parts. Customers achieve faster throughput and better reliability with a well-designed motion system.
3D inspection to increase the quality
■ Precise Laser Micromark Measuring .1mm x .1mm.
Manufacturers looking to reduce scrap monitor each stage of the manufacturing process and take corrective action early. Device programming systems equipped with 3D inspection systems identify damaged parts early in the process. This allows manufacturers to take quick corrective action, resulting in higher quality, minimized reflow and lower overall costs.
3D inspection systems provide full device package validation after programming. High-performance systems support the verification of a variety of device packages including BGA, CSP, QFP, TSOP, SOIC, and J-Lead devices. When looking for an inspection system, features should include measurements for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
Inspecting the coplanarity on leaded devices, such as the SOT-23 that measures 2.2mm x 2.7mm, ensures you do not exceed the manufacturer tolerance, which can create long-term reliability concerns of the device. The stress from bent leads may cause cracks in the package, reducing resistance against moisture and consequently present failure in the field due to internal corrosion. 3D inspection systems also identify devices with defective or missing balls on a BGA. By recognizing and removing damaged devices before final placement, manufacturers can prevent quality issues that would otherwise escape. This, in turn, improves production yield and process stability.
Laser marking for traceability
Manufacturers must thoroughly implement traceability control to maintain and confirm quality. Marking a device with a serial number, for example, enables traceability to the programming system, the site and even the socket that programmed the device.
Smaller, thinner devices require fine control of the laser power to avoid damaging the device. Additionally, smaller devices require and higher resolution marking capabilities. When purchasing a laser for your device programming system, look for a hybrid laser system that combines fiber and Nd:YAG laser technologies for precision marketing quality. Micromarking information in a limited space requires ultra-fine marketing capabilities, which is impossible with conventional laser marketing systems. Hybrid laser marking utilizes fine laser setting control, resulting in shallower marks, vivid coloration and a lower thermal impact.
By recognizing and removing damaged devices before final placement, manufacturers can prevent quality issues that would otherwise escape. This, in turn, improves production yield and process stability.
A laser with a power monitor control provides high precision calibration of the laser mark, allowing accurate measure and control of laser energy output. The ability to monitor and control the laser power avoids damage to the device and reduces scrap. In electronics manufacturing, device damage affects quality, reliability, and profitability. A hybrid laser is an optimal solution for small device marking applications where it is necessary to eliminate the effect of heat transfer and control the maximum penetration depth while also providing high-contrast micromarking.
Conclusion
Modern electronic products favor higher density devices in smaller package sizes. Manufacturers and programming centers are purchasing or upgrading existing IC device programming systems to support the demands of programming small devices. A unique set of challenges exist to pick the small device out of tape, place it in the socket, program the device, laser mark the device, inspect the device through 3D inspection, and then place it out to tape. All of this needs to happen quickly, efficiently and with high quality. Decision makers need to consider many requirements when selecting an IC device programming system capable of handling small parts. Ensure the process control software and pneumatic system are qualified for small part handling and automatically teach z-height. Look for a self-calibrating machine with a high-performance vision system capable of aligning devices at high speed, on-the-fly, during production to maximize DPH. Systems with well-designed motion systems achieve faster throughput and higher reliability. Invest in a hybrid laser with power monitoring controls and micromarking capabilities to ensure device traceability. Finally, select a 3D inspection system that performs full device validation after programming, including checks for bent leads and defective balls, for quality and lower overall costs. Following these strategies will ensure your IC device programming system handles small devices with the speed, quality and overall cost savings required for modern electronics manufacturing.
Former Director of Engineering
Srivatsan Mani was the Director of Engineering who works with electronics manufacturers and programming centers to innovate solutions that modernize and improve their businesses. With more than 16 years of experience working with device programming systems, process control software, and device programming technology at BPM Microsystems, Inc., Srivatsan knows how to leverage technology to speed up the process while producing higher quality products at lower overall costs. Srivatsan led the development of the award-winning VectorEngine™ site programming technology, patent-pending WhisperTeach™ automated z-height teaching solution, and BPWin™ process control software. Srivatsan holds a degree in electronics and communication engineering and masters in computer systems engineering.
6. Security
1. Service Excellence Award
