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Automated Programmer Peripherals

3D Inspection

Automotive | Military | Aerospace | Healthcare

3D vision inspection system options, to support verification of a variety of devices packages including BGA, CSP, QFP, TSOP, SOIC and J-Lead devices in three dimensions.  Examples of measurements include Coplanarity of all leads, Pitch, Bent leads, XY Error, Width, Diameter, Standoff and Tip Offset.

3D Inspection System Features

  • BPWin + 3D Inspection Provides Higher Yields and Efficiency
  • Avoids human and manufacturing errors before programming jobs enter production
  • Allows customization, statistical analysis, serialization and version control

Bent leads and coplanarity problems can cause soldering errors during manufacturing.   After programming, the 3D vision system measures the contacts of devices  before placed in output media to ensure quality.  Manufacturers achieve the highest production yield and process efficiency for programming mission-critical devices by integrating 3D coplanarity vision inspection, available on the 4900, 4910, and now on the 3928.

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Compatible With

Raydiance™ Laser

  • High-Contrast Micro Marking of Dynamic Alphanumeric text and 2D Codes
  • Combine Advanced Serialization and Cyber-Security for Traceability and Protection
  • Thermopile Power Monitor Controls Laser Power Output
  • Lase Plastic, Metal or Custom Materials
  • Mark Machine Readable Barcodes, DataMatrix codes, Logos and Custom Symbols
  • Extensive Library of common Dynamic Text Specifiers for Date Codes, Lot Codes, and Serial Numbers
  • Ablation of standard factory marks
  • Superior Dust-Collection, compared to other laser systems available

Precise Marking Quality

Actual laser-marked device including alphanumeric, QR Code, and logo, marked with the Raydiance™ Laser Marking System

 

The Radiance™ Laser combines the advantages of Fiber and YAG laser technologies with our latest 4000-series Automated Programming System. As programmable component volume accelerates and quality processes demand traceability, the industry needs a laser marking solution that is easy to use and delivers quality results, every time. Shrinking package sizes and range of materials require a safe, reliable system that produces human and machine-readable marks. Micro-marking information in a limited space requires ultra-fine marking capability, beyond that of conventional laser marking systems. The Raydiance™ utilizes fine control for shallow marking, producing a vivid contrast with a low thermal impact, preventing semiconductor damage. 

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Compatible With

3X Laser for 3901 and 3928 APS3000 Series Laser

  • High-contrast marking of dynamic alphanumeric text and logos
  • Font sizes as small as 0.6 mm
  • Combine Advanced Serialization and Cyber-Security for traceability and protection
  • Lase most semiconductor materials
  • Ablation of standard factory marks
  • Superior Dust-Collection, compared to other laser systems available

As programmable component volume accelerates and quality processes demand traceability, the industry needs a laser marking solution that is easy to use and delivers quality results, every time. Shrinking package sizes and range of materials require a safe, reliable system that produces human-readable marks. The 3000 Series Laser is an economical alternative to labeling systems that require consumables and pausing production to add a new roll of labels.

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Compatible With

3D Inspection

Automotive | Military | Aerospace | Healthcare

3D vision inspection system options, to support verification of a variety of devices packages including BGA, CSP, QFP, TSOP, SOIC and J-Lead devices in three dimensions.  Examples of measurements include Coplanarity of all leads, Pitch, Bent leads, XY Error, Width, Diameter, Standoff and Tip Offset.

3D Inspection System Features

  • BPWin + 3D Inspection Provides Higher Yields and Efficiency
  • Avoids human and manufacturing errors before programming jobs enter production
  • Allows customization, statistical analysis, serialization and version control

Bent leads and coplanarity problems can cause soldering errors during manufacturing.   After programming, the 3D vision system measures the contacts of devices  before placed in output media to ensure quality.  Manufacturers achieve the highest production yield and process efficiency for programming mission-critical devices by integrating 3D coplanarity vision inspection, available on the 4900, 4910, and now on the 3928.

TS1500 Automated Tray Stacking System

  • “On-The-Fly” loading and unloading of trays for true non-stop operation
  • Fits all existing BPM Microsystems’ 3000 and 4000 Series Automated Programming Systems
  • Insert and remove trays with packing straps attached (A BPM Microsystems Exclusive)
  • Separate input and output tray stacks
  • Holds up to 24 thin or 15 thick JEDEC Trays. Handles many non-JEDEC Trays

BPM Microsystems’ Automated Tray Stacking System automatically loads and unloads JEDEC trays for BPM Microsystems’ 3000 and 4000 Series Automated Programming Systems. Equipped with the capability of transferring up to 24 trays of IC devices before reloading, the TS-1500 can significantly reduce operator intervention and provide a continuous programming operation. Mistakes of passing blank part trays are avoided by the unit’s separate input and output tray stacks. The TS-1500 Automated Tray Stacking System reduces your labor costs for programming IC devices.

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Compatible With

F31SHUTTLE-T Dual Tray Shuttle

BPM Microsystem’s 3X Automated Device Programming System can be equipped with dual Automated Tray Shuttles for uninterrupted loading and unloading of device trays.  This option provides true non-stop production programming to maximize productivity.

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Compatible With

V-TEK TM-50 MK2 Tape Output Media

Large, small, or difficult-to-place parts are easy to tape with V-TEK’s TM-50. The microprocessor-controlled sealer and stepper motor drive assure precise handling of all taping parameters. Several advance speeds are selectable to accommodate problem parts and to minimize parts jumping. The innovative setup and change-over design allow any taping operator to change over carrier and cover tapes in minutes. BPM’s TM-50 MK2 has more sensors than other APS suppliers for maximum throughput and minimum errors.

  • Accommodates 8mm to 56mm tape widths
  • Compatible with both heat and pressure-sensitive cover tape
  • TM50 jobs saved in the BPWin JobMaster file and can store up to 66 jobs
  • Robust design made in the USA

Flexible, easy-to-use, menu-driven software and advanced electronic characteristics make the TM-50 a perfect choice for your taping needs.

Now available with a side-mount option for the V-TEK TM-50 tape output media. This configuration offers additional flexibility by allowing the machine to utilize options for tape, tray, tube, and marking simultaneously.

Other advantages to the side-mount option include:

  • Improved access to the machine’s programming sites
  • Less changeover time between jobs with the use of multiple-input and output media
  • Reduced operator attendance
  • Increase in the number of programmed parts

This leads to a reduced overall cost per device.

X-Stream Series Tape Feeder System

Streamline Production with the Ultimate Tape Feeder System


Turnkey System for Maximum Control Specifications
The X-Stream Series Tape Feeder System is the reliable, precise automated tape input peripheral. The X-Stream Series offers a broad range of feeder sizes, from 8mm to 56mm. Tightly-coupled with BPWin™ process control software, the X-Stream Series intelligently advances the feeder on command, ensuring the feeder presents the next device as needed.

Fast Setup and Changeover Maximize Productivity
The X-Stream Series provides easy setup and fast changeover. Intuitive buttons control tape advance and reverse for simple pick point adjustment and calibration. The one-button electronic pitch selection makes it easy to change from tape sizes. Each feeder body includes an input reel holder, accommodating reels up to 15 inches in diameter. An ergonomic handle eases operator handling and installation.

Precise and Accurate Handling for Even the Smallest Device Package
Small CSP package handling requires smooth indexing, accuracy, and repeatability. The 8mm and 12mm X-Stream Series feeders are specially engineered to include a pick window with a spring-loaded insert. This stabilizes vibration by applying downward pressure to the carrier tape, resulting in the precise presentation of small components to the APS nozzle. Controlled tension between the input reel and feeder provides fluid carrier tape movement, producing uninterrupted production programming.

Robust Feeder Solution for Low Cost of Ownership
Designed for high-speed pick and place machines, X-Stream Series feeders are robust with minimal service requirements. If an unexpected error does occur, the on-board diagnostics feature and electronic calibration make troubleshooting fast and easy.

  • Trouble-free handling of the smallest CSP devices
  • Exclusive spring-loaded pick window prevents popcorn-effect
  • Proven 2mm pitch support, ready for the smallest parts
  • Reliable and smooth tape indexing prevents jams and recoil
  • Easy one-button pitch selection slashes setup time
  • Ergonomic design provides easy operator handling and setup
  • Fast and accurate indexing ensures uninterrupted production
  • Engineered specifically to operate with BPWin process control software

Single Lane Tube Feeder/Loader

BPM Microsystems has developed a solution for small parts fed from tubes to the automated programming systems. The Single Lane Tube Feeder/Loader addresses the consistent feeding and reloading of small package parts.

Tooling for the Single Lane Tube Feeder/Loader is currently available for 8-pin SOIC, TSSOP, MSOP, and 6 pin TSOC devices. The feeder/loader uses specific interchangeable tooling for each package size.

Multiple base units of this ultra-compact automated programming system peripheral can be mounted on one machine for expanded handling potential. The Single Lane Tube Feeder/Loader can fit six feeder/loader bases in a 5-inch area (12.7 cm). Each APS input is capable of holding two bases for a total of 12 feeder/loader combinations.

BPM Microsystems supports the Single Lane Tube Feeder/Loader on its 3000 series and 4000 series automated programming systems.

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Compatible With

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