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Security Solutions from BPM

Security Solutions from BPM

Unlike other security solutions that are expensive, rigid, and one-size-fits-all, BPM offers a range of options based on your particular needs

BPM’s Security Solution for programming, BPM.NCRYPT, can utilize your existing HSM, secure server, or any other networked and offline data sources. BPM Microsystems can also provide a turn-key package that is flexible, scalable, and affordable.

Why trust BPM.NCRYPT?

Security and the encryption of programmable devices to protect intellectual property and the products in which these devices are used has never been more important than it is today. In fact, customers have been trusting BPWin, BPM’s award-winning Process Software, to provide robust, innovative security solutions for over twenty years.

BPM.NCRYPT leverages 36 years of supporting mission-critical devices along with our proven experience developing and releasing sophisticated security and encryption solutions that meet your unique needs. All of our automated machines are enabled to support MES factory integration with BPWin API and include complex security features, at no additional cost. If you are like us, we believe one size or one solution does not fit all. It starts with a conversation– what do you want to accomplish?

Learn More See Real-World Case Studies
35 Years of NAND Flash Memory

35 Years of NAND Flash Memory

35 Years of NAND Flash Memory

2022 marks the 35th anniversary of the invention of NAND flash memory. NOR Flash memory was invented by Dr. Fujio Masuoka while working for Toshiba in 1984. NOR-based flash has long erase and write times but has a full address/data (memory) interface that allows random access to any location. This makes it suitable for the storage of program code that needs to be infrequently updated, such as a computer’s BIOS or the firmware of set-top boxes. Its endurance is 10,000 to 1,000,000 erase cycles. NOR-based flash was the basis of early flash-based removable media; Compact Flash was originally based on it, though later cards moved to the cheaper NAND flash.

NAND flash was born out of a joint venture with Samsung and Toshiba and followed shortly thereafter. It has faster erase and write times, higher density, lower cost per bit than NOR flash, and ten times the endurance. However, it is most suitable for mass-storage devices such as PC cards and various memory cards because of its sequential write and is less useful for computer memory.

BPM has been around slightly longer than NAND Flash and has developed solutions for some of the particular challenges of programming flash devices. See the Flash white papers below.

KIOXIA Celebrates the 35th Anniversary of Invention of NAND Flash Memory

 

SAN JOSE, Calif., February 10, 2022 – What do the MP3 players of the 1990s and today’s smartphones have in common? Neither would exist were it not for NAND flash memory, an innovation whose influence has reverberated throughout the decades. KIOXIA America, Inc. today announced that it has reached a new milestone – 2022 marks the 35th anniversary of the company’s invention of NAND flash memory.

NAND Flash Video

A new humorous video series from KIOXIA, that explores life without flash memory, kicks off with a look at cloud computing

Flash Memory White Papers

Signal Integrity

Signal Integrity

Not all programming solutions are the same. If quality and maximum device life are important, it’s imperative to know what to look for. When evaluating a programming solution, ask about signal integrity. Review this white paper for helpful tips.

Mastering eMMC Device Programming

Mastering eMMC Device Programming

Over the past decade, the demand for high-density, nonvolatile memories with a small footprint has increased dramatically. Two of the most popular markets driving this demand are handheld devices and automotive. Demand for handheld devices continues to drive the research for high-density, low power, low-cost, high-speed, nonvolatile memories while maintaining a small footprint. NAND-type flash memory is the perfect match for such a market. The increased consumer demand for high-tech features in automobiles, such as infotainment systems, is also a big driver of demand for high-density NAND-based devices.

Understanding NAND Flash Factory Programming

Understanding NAND Flash Factory Programming

During the manufacturing of electronic systems, blank non-volatile devices must often be programmed with initial data content. This allows the target system to get up and running, and is referred to as “factory programming,” “factory pre-programming,” or “bulk programming.” Generally, this is a very straightforward process that has been in place in the industry for many years. However, with NAND flash the process is more difficult.

BPM Support for eMMC Devices in HS400 Mode

BPM Support for eMMC Devices in HS400 Mode

HS400 mode significantly increases programming speeds on eMMC devices, especially compared to other programming modes. HS400 programming mode enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput.

Manufacturer/Device Package 9th Gen Socket Purchase Online
Hynix Semiconductor H26M41208HPR (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Hynix Semiconductor H26M41204HPR (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Kingston EMMC04G-W627-X03U (HS400) BGA(153) Yes FVE4ASML153BGL*, FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Micron MTFC4GACAJCN-1M WT (HS400) BGA(153) Yes FVE4ASML153BGL*, FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
SanDisk SDINBDG4-16G (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Samsung KLMAG1JETD-B041 (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes
Samsung KLM4G1FETE-B041 (HS400) BGA(153) Yes FVE4ASMC153BGR Yes
SkyHigh S40FC004C1B1C0000 (HS400) BGA(153) Yes FVE4ASMC153BGJ, FVE4ASMC153BGZ Yes

*HIC Socket (high capacity)


New eMMC Support for HS400 Mode

Hynix Semiconductor H26M41208HPR (8/3/2021)

Device Parameters

  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Hynix Semiconductor H26M41204HPR (8/3/2021)

Device Parameters

  • 8-bit Bytes: 8804892672
  • Memory Regions: 0h-1 EFA7 FFFFh; 1 EFA8 0000h-2 0CCF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Kingston EMMC04G-W627-X03U (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4270325760
  • Memory Regions: 0h-F063 FFFFh; F064 0000h-FE87 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASML153BGL (HIC Socket), FVE4ASMC153BGJ, FVE4ASMC153BGZ

Micron MTFC4GACAJCN-1M WT (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4402446336
  • Memory Regions: 0h-F7D3 FFFFh; F7D4 0000h-1 0667 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASML153BGL (HIC Socket), FVE4ASMC153BGJ, FVE4ASMC153BGZ

SanDisk SDINBDG4-16G (8/3/2021)

Device Parameters

  • 8-bit Bytes: 17737187328
  • Memory Regions: 0h-3 E67B FFFFh; 3 E67C 0000h-4 2137 FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 16 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Samsung KLMAG1JETD-B041 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 17597988864
  • Memory Regions: 0h-3 DEA5 FFFFh; 3 DEA6 0000h-4 18EB FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 16 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ

Samsung KLM4G1FETE-B041 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4407164928
  • Memory Regions: 0h-F817 FFFFh; F818 0000h-1 06AF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGR

SkyHigh Memory S40FC004C1B1C0000 (8/3/2021)

Device Parameters

  • 8-bit Bytes: 4407164928
  • Memory Regions: 0h-F817 FFFFh; F818 0000h-1 06AF FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 4 GByte
  • Algorithm Programming Mode: HS400
  • Sockets: FVE4ASMC153BGJ, FVE4ASMC153BGZ
BPM’s File Builder Wizard makes eMMC Programming Easy

BPM’s File Builder Wizard makes eMMC Programming Easy

eMMC File Concatenate Wizard Saves Time, Streamlines Workflow, Reduces Errors



BPM Microsystems have the best programmers, especially when it comes to complex microprocessors and high-density eMMC devices. BPM’s 9th Generation universal programmers offer the fastest flash programming times, as well as the widest universal device coverage, all in a single, universal programming site. With over 40,000 supported devices, there’s no one else that comes close.

eMMC devices have large, complex data patterns (4GB and up) that can be difficult to set up and prone to operator error. Previously, you had to manually load each eMMC data pattern one by one through the buffer loader. Depending on the complexity, this step was repeated three or more times. Each data pattern also required a manual calculation of data offsets, with no way to provide the checksum. As eMMC devices have gotten larger, the technical challenge of the file structure has become more complicated.

That is, until now.

Now, you can use the configuration information (which should be provided with the eMMC device) to streamline your workflow, eliminate errors, and simplify set-ups. Utilizing a Microsoft Excel template, you can easily streamline file formatting by giving you one document to capture the specifics of the eMMC project, and then utilizing parts of it for the automation tool. The template can also be shared with 3rd parties or saved as a historical record of the project specifications.

On average, the eMMC Wizard should only take a few minutes to edit the data template, and about 10 minutes for the tool to create the data pattern. While the file is outputting, the tool automatically calculates the checksums and verifies them on the fly. Multiple checksum options are available from the pull-down in the Excel template. It also replaces the manual calculation for each offset with an automated calculator, reducing the possibility of errors.

eMMC File Builder Wizard

In order to use the eMMC File Concatenate Wizard, you’ll need the latest version of BPWin, which can be downloaded here. (If your Software contract is expired, you may need to renew it; contact Inside Sales).

All new eMMC algo development will use a standard template that supports the file Wizard. In some cases, older algorithms will not be compatible. Please enter a Device Support request if you need an update to a legacy algorithm that is not currently compatible with the Wizard. If an algo does not support it (yet), you will be presented with this message:

You can submit a device support request here.

eMMC Wizard Example

In this example, we’ll use a Samsung eMMC with HS400 support. Select the Samsung KLMAG1JETD-B041 device/algo in BPWin. Then navigate to the File Concatenation tool via either the “Device” menu in the BPWin toolbar or by clicking the “Device Config” button, followed by “File Concatenation“.

You will now be asked to select an input configuration file and an output location. Select the output location for your concatenated file.

The input will need to be a filled-out Excel sheet, based on the template found here. Fill out the GP_SIZE_MULT_X fields (provided by the semi house), and the list of files, offsets, and checksums below. Don’t forget to select a specific checksum type from the dropdown menu, or the tool will not know how you want the checksum calculated.

Here are some examples of filled-out templates:

(Since the template requires user-inputted paths to the specified files, you need to ensure that the files are actually located there.)

Once you have selected an input configuration file and output location, click “Concatenate” and wait for the operation to finish. In the end, there should be an “output.bin” file located in the folder you specified earlier.

The green status bar will let you know your file is processing. Depending on file size, this may take several minutes

The concatenate wizard takes a few minutes to finish. If you are utilizing HS200 or HS400, you’ll still need to run the file through the image format tool– navigate via either the “Device” menu in the BPWin toolbar or by clicking the “Device Config” button, followed by “image format“ (remember, this is for HS200/400).

That’s it!

In summation, the eMMC File Wizard makes eMMC programming much easier and faster by walking through the steps to quickly build your files. This ensures quality programming results from first article qualification through production.

The eMMC File Concatenation Wizard is available with BPWin Version 7.0.7 and later. If you have any questions, please reach out to our Technical Support team. If you need to update your software agreement, please contact Inside Sales.

HS400 Programming Improves eMMC Performance

HS400 Programming Improves eMMC Performance

According to the JESD84-B51 standard, eMMC v5.1 supports the following bus speed modes and clock frequencies:

Mode

Data
Rate

I/O Voltage

Bus Width
(bits)

Frequency

Max. Data Transfer 

HS400 Dual

1.8/1.2 V

8

0-200 MHz

400 MB/second

HS200

Single

1.8/1.2 V

4, 8

0-200 MHz

200 MB/second

High-Speed DDR

Dual

3/1.8/1.2 V

4, 8

0-52 MHz

104 MB/second

High-Speed SDR

Single

3/1.8/1.2 V

1, 4, 8

0-52 MHz

52 MB/second

HS400 mode significantly increases programming speeds on eMMC devices, especially compared to other programming modes. HS400 programming mode enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput.

BPM has recently added support for the following eMMC devices in HS400 Programming Mode:

Manufacturer/Device Package 9th Gen Socket Purchase Online
SanDisk SDINBDG4-8G (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Samsung KLMCG2KCTA-B041000 (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Micron MTFC32GAKAEJP-AIT (HS400) BGA(153) Yes FVE4ASMC153BGZ
Micron MTFC32GAKAECN-4M IT (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRQ (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRN (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRI (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes
Hynix Semiconductor H26M41208HPRA (HS400) BGA(153) Yes FVE4ASMC153BGJ Yes

HS400 Programming Mode

SanDisk SDINBDG4-8G (6/22/2021)

SanDisk SDINBDG4-8GDevice Parameters

  • Manufacturer: SanDisk (ID=45h)
  • Part Number: SDINBDG4-8G (HS400) (ID=3038h)
  • 8-bit Bytes: 8807030784
  • Memory Regions: 0h-1 EFC6 CFFFh; 1 EFC6 D000h-2 0CF0 9FFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Samsung KLMCG2KCTA-B041000 (6/22/2021)

Device Parameters

  • Manufacturer: Samsung (ID=15h)
  • Part Number: KLMCG2KCTA-B041000 (HS400) (ID=3432h)
  • 8-bit Bytes: 70354206784
  • Memory Regions: 0h-F 7877 FFFFh; F 7878 0000h-10 616F FE1Fh; 10 616F FE20h-10 6170 003Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 64 GByte
  • Socket: FVE4ASMC153BGJ

Micron MTFC32GAKAEJP-AIT (6/22/2021)

Micron-MTFC32GAKAEDevice Parameters

  • Manufacturer: Micron (ID=13h)
  • Part Number: MTFC32GAKAEJP-AIT (HS400) (ID=374Ch)
  • 8-bit Bytes: 35181822048
  • Memory Regions: 0h-7 BC7F FFFFh; 7 BC80 0000h-8 30FF FE3Fh; 8 30FF FE40h-8 3100 005Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 32 GByte
  • Socket: FVE4ASMC153BGZ

Micron MTFC32GAKAECN-4M IT (6/22/2021)

Micron-MTFC32GAKAE

Device Parameters

  • Manufacturer: Micron (ID=13h)
  • Part Number: MTFC32GAKAECN-4M IT (HS400) (ID=374Ch)
  • 8-bit Bytes: 33218887808
  • Memory Regions: 0h-7 4DFF FFFFh; 7 4E00 0000h-7 BBFF FE5Fh; 7 BBFF FE60h-7 BC00 007Fh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Algorithm Programming Mode: HS400
  • Default Device Size: 32 GByte
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRQ (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRQ (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 Gig
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRN (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRN (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRI (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRI (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ

Hynix Semiconductor H26M41208HPRA (6/22/2021)

Hynix Semiconductor H26M41208Device Parameters

  • Manufacturer: Hynix Semiconductor (ID=90h)
  • Part Number: H26M41208HPRA (HS400) (ID=6132h)
  • 8-bit Bytes: 8814329856
  • Memory Regions: 0h-1 F02F FFFFh; 1 F030 0000h-2 0D5F FFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Packages: BGA(153)
  • Device Type: eMMC
  • Device Size: 8 GByte
  • Algorithm Programming Mode: HS400
  • Socket: FVE4ASMC153BGJ
BPM Releases First-In-Family Support For Cypress Traveo Family Automotive MCU

BPM Releases First-In-Family Support For Cypress Traveo Family Automotive MCU

BPM Releases First-In-Family Support For Cypress Traveo Family Automotive MCU

First major programmer to support Cypress (Infineon) S6J3200 Series– 32-bit Microcontroller Traveo Family S6J326CLSPSC20000

BPM is pleased to announce 9th Generation support for the Infineon/Cypress Automotive MCU (Microcontroller) S6J326CLSPSC20000. BPM is the only company among our major competitors (Data I/O, DediProg, Elnec, etc.)  that currently provides programming for this device. 9th Gen Programmers from BPM include two manual programmers: 2900 and 2900L; Automated Programmers are the 3901, 28 Socket 3928, & 48 Socket 4910. The Traveo II family is connected-car-ready with a high-performance CPU.  Traveo II provides great connectivity capabilities like CAN FD, CXPI, Ethernet, and FlexRay for faster communication and increased data bandwidth.

S6J3200 Series– 32-bit Microcontroller Traveo Family

The Traveo MCU S6J3200 family features 32-bit RISC microcontrollers with an Arm® Cortex®- R5 core and operates up to 240 MHz. This microcontroller comes with highly efficient 2D/3D graphic engines with advanced feature sets for memory saving, safety, and high image quality to help manufacturers take advantage of the lower overall system costs. It also meets the increasingly high levels of performance and quality that industrial, consumer, and automotive applications demand. In addition, this microcontroller offers support for the Cypress HyperBusTM memory interface, a breakthrough that dramatically improves read performance while reducing the number of pins. This microcontroller comes with Ethernet AVB, CAN-FD, a high-speed communication protocol compatible with the conventional CAN, and Secure Hardware Extension (SHE) as a security function. 

Features

  • System
    • 32-bit Arm Cortex-R5F CPU core at up to 240 MHz GPIO port: Up to 120
    • 12-bit A/D converter: Up to 50 channels
    • External interrupt: Up to 16 channels
    • Base timer: Up to 24 channels
    • 32-bit free-run timer: Up to 12 channels
    • Built-in CR oscillators
    • Real-time clock
    • Input capture unit: Up to 24 channels
    • Output compare unit: Up to 24 channels
    • DMA controller: 16 channels
    • Stepper motor controller (SMC): Six units
    • JTAG debug interface
  • Graphics and Display
    • 2D graphic engine
    • 3D graphic engine (optional)
    • Timing generator – TCON
    •  TTL/RSDS
    • FPD-Link – LVDS (optional)
    • Video capture (optional)
    • Communication: Ethernet AVB MAC (optional) CAN-FD: up to four channels
    • Multi-function serial interface: up to 12 channels, selectable protocol: UART, CSIO, LIN, and I2C MediaLB: up to one channel (optional)
  • Manufacturer: Cypress
  • Part Number: S6J326CLSPSC20000
  • 16-bit words: 117497856
  • Memory Regions: CF 8000h-DF FFFFh; 700 0000h-700 DFFFh
  • Vcc(program): 3.3
  • Electrical Erase: Yes
  • Set programming: Yes
  • Package: QFP(216)
  • 9th Gen Socket Solution: FVE2ASM216TQFPA
  • Available on BPM’s Process software BPWin Versions released after 05/05/2021

IMPORTANT:

  • Device Type: ARM Cortex-R5F Core based Microcontroller
  • Device Size: 2,112 KB (Program Flash) + 112 KB (Work Flash).
  • Algorithm Programming Method: Parallel Flash Programming Mode.

Unique Support

As of publication, BPM has the only supported solution for this particular automotive MCU. Cypress devices currently supported by BPM stand at 1,999. Infineon devices currently supported by BPM stand at 203.

  Supported* Socket
Elnec No  
Data I/O No  
System General No  
Xeltek No  
Dediprog No  
BPM Yes FVE2ASM216TQFPA

*As of publication

9th Gen

9th Generation Site Technology delivers the fastest programming times, 2 to 9 times faster for flash devices. Vector Engine™ Co-processing with BitBlast offers the fastest programming speeds in the industry, vastly increasing throughput for automotive MCUs.

BPWin Software Support

In order to fully take advantage of new device support from BPM Microsystems, you’ll need a version of BPWin after 05/05/2021. New programmers come with one year of software support; if your software contract has lapsed, please contact Inside Sales to take advantage of daily additions and improvements in device support.

Complete Ecosystem

BPM Microsystems has ownership of all designs, manufacturing, and support for all programming sites, robotics, vision systems, and software, so we can provide unmatched support and responsiveness

  • Reduce your time to market by doing New Product Introduction/First Article through Automated Production with the same hardware, algorithms, and software

9th Generation Site Technology

Number of Devices Supported by 9th Gen

Newest Supported Devices

BPM Support for eMMC Devices in HS400 Mode

BPM Support for eMMC Devices in HS400 Mode

HS400 mode significantly increases programming speeds on eMMC devices, especially compared to other programming modes. HS400 programming mode enables programming eMMC devices at greater speeds (up to 400MB/Second) with improved throughput. Manufacturer/Device Package...