HOUSTON, TX-Dec. 4, 2017-SMT Global & Packaging interviews James Holava, BPM Director of Global Sales, at Productronica about new BPM innovations. BPM is now on its 9th gen site technology platform, which is backwards compatible with most 6th, 7th and 8th generation sockets. Ninth generation supports the majority of the 39,000+ library of components and devices that BPM has collected since 2002. This helps clients leverage many existing sockets and gives clients ease regarding the lifespan of future investments.
With the trend in the industry of higher density and smaller package devices, ninth generation technology also supports the EMMC devices and the HS400 programming mode at 200 MB per second. This provides the throughput manufacturers need today in modern production. To improve handling for smaller devices packages, BPM also introduced a new program called WhisperTeach™. WhisperTeach™ automatically teaches the Z-height of components and removes the opportunity for manual defects.
BPM 9th gen site technology is available on the 4900 and 3900 automated programming systems, as well as the 2900L and 1900 systems. To learn more about BPM ninth generation site technology and programmers, please contact BPM.
HOUSTON, TX–(U.S. Tech)–Oct. 26, 2017– BPM Microsystems will demonstrate its new 4900 automated memory programming system at Productronica, scheduled to take place November 14 – 17, 2017 in Munich, Germany. The 4900, with its advanced chip-scale part (CSP) device handling, on-the-fly vision alignment, and HS400 programming speeds, satisfies a vast range of programming needs in one automated system. Featuring high-performance laser marking and 3D inspection, the 4900 provides advanced serialization and quality control, meeting the highest programming and cyber security standards for automotive, aerospace, medical, industrial and mobile device industries.
The 4900 is powered by the newest BPM 9th generation technology. This technology programs eMMC in HS400 mode, the highest speed mode available, as well as HS200, DDR and SDR. The 4900 supports a high-mix of devices on the same site, including microcontrollers, FPGA, eMMC, NAND, NOR and Serial Flash, delivering speed and versatility on one system.
Innovations for advanced CSP device handling include BPM patent-pending WhisperTeach™ technology, which fully automates teaching the smallest CSP devices. A new camera delivers vision alignment across the x, y, and z axes, to accurately align small devices while in motion. The new alignment and positioning capabilities of the 4900 allow it to operate at full speed when handling CSP devices.
The 4900 introduces a new hybrid laser that combines fiber and Nd:YAG laser technologies for precision marking quality. Built-in mark verification and laser power monitoring at the point of mark ensure a consistent, damage-free mark on every device. The integrated 3D Inspection system completes the 4900 by delivering full device package validation after programming. The 3D Inspection checks BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors. 3D Inspection ensures each device meets specifications resulting in higher quality devices and lower overall costs.